SI: IGF25 – International Conference 2019
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Vol. 14, No. 51 (2020) pp. 541-551
Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation
This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an…