Fracture and Structural Integrity e-ISSN 1971-8993 Open access
SI: IGF25 – International Conference 2019 Vol. 14, No. 51 (2020)

Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

Author and affiliation details
DOI
10.3221/IGF-ESIS.51.41
Pages
541-551
Published
Published inVol. 14, No. 51 (2020)Go to the issue

Abstract

This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs).

Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, the surface level differences on which the PCB is placed, the process of assembling the electronic components induces a certain state of stress and deformation in the PCB. The main components affected are microprocessors due to the way they are glued to PCBs with BGA - Ball grid arrays (BGA).

Digital Image Correlation (DIC) is a full-field contactless optical method for measuring displacements and strain in experimental testing, based on the correlation of images taken during test. The experimental setup is realized with Dantec Q-400 system used for image capture and Istra 4D software for image correlations and data analyses. The maximum level of the obtained strain is compared with the allowable limit.

Finite element analysis (FEA) is a numerical method of analysis for stresses and strain in structures of any given geometry.

Keywords

Article history

  1. ReceivedUntil the next stage: 39 days
  2. RevisedUntil the next stage: 0 days
  3. AcceptedUntil the next stage: 6 days
  4. Published

Statements

Funding

Romanian Ministry of Research and Innovation

About the authors

Liviu Marsavina

Director of Mechanics and Strength of Materials Department
Faculty of Mechanical Engineering
POLITEHNICA University of Timisoara

How to cite

APA

Marsavina, L., Falk, A., & Pop, O. (2019). Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation. Fracture and Structural Integrity, 14(51), 541–551. https://doi.org/10.3221/IGF-ESIS.51.41

IEEE

L. Marsavina, A. Falk, and O. Pop, “Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation,” Fracture and Structural Integrity, vol. 14, no. 51, pp. 541–551, 2019, doi: 10.3221/IGF-ESIS.51.41.

MLA

Marsavina, Liviu, et al. “Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation.” Fracture and Structural Integrity, vol. 14, no. 51, 2019, pp. 541–551. https://doi.org/10.3221/IGF-ESIS.51.41.

Chicago

Marsavina, Liviu, Alexandru Falk, and Octavian Pop. 2019. “Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation.” Fracture and Structural Integrity 14 (51): 541–551. https://doi.org/10.3221/IGF-ESIS.51.41.

Harvard

Marsavina, L., Falk, A. and Pop, O. (2019) ‘Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation’, Fracture and Structural Integrity, 14(51), pp. 541–551. doi: 10.3221/IGF-ESIS.51.41.

Vancouver

Marsavina L, Falk A, Pop O. Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation. Fracture and Structural Integrity. 2019;14(51):541-551. doi:10.3221/IGF-ESIS.51.41

BibTeX

@article{marsavina2019, author = {Marsavina, Liviu and Falk, Alexandru and Pop, Octavian}, title = {Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation}, journal = {Fracture and Structural Integrity}, year = {2019}, volume = {14}, number = {51}, pages = {541--551}, doi = {10.3221/IGF-ESIS.51.41}, url = {https://doi.org/10.3221/IGF-ESIS.51.41}, issn = {1971-8993} }

RIS

TY - JOUR AU - Marsavina, Liviu AU - Falk, Alexandru AU - Pop, Octavian TI - Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation JO - Fracture and Structural Integrity T2 - Fracture and Structural Integrity PY - 2019 DA - 2019/12/14 VL - 14 IS - 51 SP - 541 EP - 551 DO - 10.3221/IGF-ESIS.51.41 UR - https://doi.org/10.3221/IGF-ESIS.51.41 SN - 1971-8993 ER -

Licence

Copyright © 2020 Liviu Marsavina, Alexandru Falk, Octavian Pop.

Copyright 
Authors are allowed to retain both the copyright and the publishing rights of their articles without restrictions.  

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