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Wafer bonding describes all technologies for joining two or more substrates directly or using certain intermediate layers. Current investigations are focused on so-called low temperature bonding as a special direct bonding technology. It…
New experimental technique for a determination of the stress intensity factor (SIF) and T-stress values is developed and verified. The approach assumes combining the crack compliance method and optical interferometric measurements of local…
Localized displacement measurements based on electronic speckle-pattern interferometry are used to obtain crack mouth opening displacement (CMOD), stress intensity factor (SIF) and T-stress values during crack growth around cold-expanded…
The novel destructive method is implemented for quantitative assessment of fatigue damage accumulation in the stress concentration zone accompanied by residual stress due to cold expansion of the through-thickness hole. Damage accumulation…
The compliance method was first applied to short rod specimens to determine the nonlinear fracture toughness of rock materials by ISRM (International Society for Rock Mechanics) in the 1980s. In this study, utilizing the techniques of the…
Experimental method for a characterization of high-cycle fatigue evolution of residual stress near cold-expanded hole is developed and implemented. The technique is based on simultaneous measurements of deformation response to narrow…
In the present work, the fracture resistance of a carbon fiber composite under mode I and mode II loading have been experimentally determined. For the mode I and II, the energy release rate G has been determinate for each material. In some…
