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Residual stresses occur in many manufactured structures and components. Great number of investigations have been carried out to study this phenomenon. Over the years, different techniques have been developed to measure residual stresses…
This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an…
A new experimental method for measuring strain fields in highly deformable materials has been developed. This technique is based on an in-house developed Digital Image Correlation (DIC) system capable of accurately capturing localized or…
The knowlegde of dynamic mechanical properties is useful in all cases where the strain rate sensitivity of metallic materials is an issue, and whenever the actual loading conditions for a structure (either in normal operation or under…
This work presents a novel methodology for characterising fatigue cracks under biaxial conditions. The methodology uses high magnification Digital Image Correlation (DIC) technique for measuring displacement and strain crack-tip fields. By…
The energy dissipation in metals in the process of irreversible deformation leads to intensive heat generation in the areas in the strain localization zones. This work is devoted to the measuring the power of heat sources by means of the…
