Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders
This study discusses an effect of additive elements on crack propagation behaviour for low-Ag contain Sn1.0Ag0.7Cu lead-free solders at high temperature. A cyclic push-pull loading tests for four kinds of Sn1.0Ag0.7Cu solders were…