Fracture and Structural Integrity e-ISSN 1971-8993 Open access
SI: Developments in the fracture and fatigue assessment of materials Vol. 12, No. 46 (2018)

Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders

Author and affiliation details
DOI
10.3221/IGF-ESIS.46.03
Pages
25-33
Published
Published inVol. 12, No. 46 (2018)Go to the issue

Abstract

This study discusses an effect of additive elements on crack propagation behaviour for low-Ag contain Sn1.0Ag0.7Cu lead-free solders at high temperature. A cyclic push-pull loading tests for four kinds of Sn1.0Ag0.7Cu solders were conducted at 313 K with a single hole specimen. Stress amplitude of solders containing additive element Bi were bigger than that of Bi-free solders. Crack initiation cycle of solders containing Bi were earlier than that of Bi-free solders. Low-Ag solders containing Bi had shorter crack propagation cycles than that of Bi-free solders. These results indicate that the additive element Bi have the effects on the crack initiation and propagation cycles, that is, Bi accelerates the crack propagation rate. We also discuss the adaptation of J-integral range parameter to the crack propagation rate evaluation for solders. J-integral range parameter evaluates the crack propagation rate for low-Ag solders independent of the additive elements.

Keywords

Article history

  1. ReceivedUntil the next stage: 29 days
  2. Revision requestedUntil the next stage: 33 days
  3. RevisedUntil the next stage: 0 days
  4. AcceptedUntil the next stage: 146 days
  5. Published

How to cite

APA

Hiyoshi, N., Yamashita, M., & Hokazono, H. (2018). Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders. Fracture and Structural Integrity, 12(46), 25–33. https://doi.org/10.3221/IGF-ESIS.46.03

IEEE

N. Hiyoshi, M. Yamashita, and H. Hokazono, “Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders,” Fracture and Structural Integrity, vol. 12, no. 46, pp. 25–33, 2018, doi: 10.3221/IGF-ESIS.46.03.

MLA

Hiyoshi, Noritake, et al. “Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders.” Fracture and Structural Integrity, vol. 12, no. 46, 2018, pp. 25–33. https://doi.org/10.3221/IGF-ESIS.46.03.

Chicago

Hiyoshi, Noritake, Mitsuo Yamashita, and Hiroaki Hokazono. 2018. “Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders.” Fracture and Structural Integrity 12 (46): 25–33. https://doi.org/10.3221/IGF-ESIS.46.03.

Harvard

Hiyoshi, N., Yamashita, M. and Hokazono, H. (2018) ‘Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders’, Fracture and Structural Integrity, 12(46), pp. 25–33. doi: 10.3221/IGF-ESIS.46.03.

Vancouver

Hiyoshi N, Yamashita M, Hokazono H. Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders. Fracture and Structural Integrity. 2018;12(46):25-33. doi:10.3221/IGF-ESIS.46.03

BibTeX

@article{hiyoshi2018, author = {Hiyoshi, Noritake and Yamashita, Mitsuo and Hokazono, Hiroaki}, title = {Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders}, journal = {Fracture and Structural Integrity}, year = {2018}, volume = {12}, number = {46}, pages = {25--33}, doi = {10.3221/IGF-ESIS.46.03}, url = {https://doi.org/10.3221/IGF-ESIS.46.03}, issn = {1971-8993} }

RIS

TY - JOUR AU - Hiyoshi, Noritake AU - Yamashita, Mitsuo AU - Hokazono, Hiroaki TI - Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders JO - Fracture and Structural Integrity T2 - Fracture and Structural Integrity PY - 2018 DA - 2018/09/23 VL - 12 IS - 46 SP - 25 EP - 33 DO - 10.3221/IGF-ESIS.46.03 UR - https://doi.org/10.3221/IGF-ESIS.46.03 SN - 1971-8993 ER -

Licence

Copyright © 2018 Noritake Hiyoshi.

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