Numerical and experimental study of the behavior of a polyamide during the ECAE process using a 105° die. Fracture and Structural Integrity, [S. l.], v. 20, n. 76, p. 238–264, 2026. DOI: 10.3221/IGF-ESIS.76.15. Disponível em: https://staging.fracturae.com/index.php/fis/article/view/5736. Acesso em: 16 oct. 2026.