Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module. Fracture and Structural Integrity, [S. l.], v. 15, n. 55, p. 316–326, 2020. DOI: 10.3221/IGF-ESIS.55.24. Disponível em: https://staging.fracturae.com/index.php/fis/article/view/2941. Acesso em: 16 oct. 2026.