Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders. Fracture and Structural Integrity, [S. l.], v. 12, n. 46, p. 25–33, 2018. DOI: 10.3221/IGF-ESIS.46.03. Disponível em: https://staging.fracturae.com/index.php/fis/article/view/2033. Acesso em: 16 oct. 2026.