Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads. Fracture and Structural Integrity, [S. l.], v. 5, n. 15, p. pages 64–73, 2013. DOI: 10.3221/IGF-ESIS.15.07. Disponível em: https://staging.fracturae.com/index.php/fis/article/view/109. Acesso em: 16 oct. 2026.