Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers. Fracture and Structural Integrity, [S. l.], v. 5, n. 15, p. pages 21–28, 2013. DOI: 10.3221/IGF-ESIS.15.03. Disponível em: https://staging.fracturae.com/index.php/fis/article/view/105. Acesso em: 16 oct. 2026.