Fracture and Structural Integrity e-ISSN 1971-8993 Open access
Miscellanea Vol. 7, No. 23 (2013)

On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS

Author and affiliation details
  • Riccardo Casati Corresponding author Department of Mechanical Engineering, Politecnico di Milano, Via La Masa 34, Milano, Italy iacoviello@unicas.it
  • Maurizio Vedani Department of Mechanical Engineering, Politecnico di Milano, Via La Masa 34, Milano, Italy
  • Syed A. M. Tofail Materials and Surface Science Institute, University of Limerick, Limerick, Ireland
  • Calum Dikinson Materials and Surface Science Institute, University of Limerick, Limerick, Ireland
  • Ausonio Tuissi National Research Council (CNR-IENI), Corso Promessi Sposi 29, Lecco, Italy
DOI
10.3221/IGF-ESIS.23.01
Pages
Pages 7-12
Published

Abstract

Shape memory alloy (SMA) wires are employed as actuators in small devices for consumer electronics, valves and automotive applications. Because of the continued miniaturization of all the industrial products, nowadays the tendency is to produce MEMS (micro electromechanical systems). Among the most promising functional MEMS materials, the thin SMA wires that are offering a rapid actuating response with high power/weigh ratio of the material, are attracting a world wide interest. This paper is aimed at showing the production process and the characterizations of thin NiTi shape memory wires. The activity was focused on drawing procedure and on functional and TEM characterizations of the final products. In particular, it was evaluated the performance of the SMA wires for actuators in terms of functional fatigue and thermo-mechanical properties by means of an experimental apparatus design ad hoc for these specific tests

Keywords

Article history

  1. ReceivedUntil the next stage: 0 days
  2. AcceptedUntil the next stage: 0 days
  3. Published

How to cite

APA

Casati, R., Vedani, M., Tofail, S. A. M., Dikinson, C., & Tuissi, A. (2012). On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS. Fracture and Structural Integrity, 7(23), Pages 7–12. https://doi.org/10.3221/IGF-ESIS.23.01

IEEE

R. Casati, M. Vedani, S. A. M. Tofail, C. Dikinson, and A. Tuissi, “On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS,” Fracture and Structural Integrity, vol. 7, no. 23, pp. Pages 7–12, 2012, doi: 10.3221/IGF-ESIS.23.01.

MLA

Casati, Riccardo, et al. “On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS.” Fracture and Structural Integrity, vol. 7, no. 23, 2012, pp. Pages 7–12. https://doi.org/10.3221/IGF-ESIS.23.01.

Chicago

Casati, Riccardo, Maurizio Vedani, Syed A. M. Tofail, Calum Dikinson, and Ausonio Tuissi. 2012. “On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS.” Fracture and Structural Integrity 7 (23): Pages 7–12. https://doi.org/10.3221/IGF-ESIS.23.01.

Harvard

Casati, R., Vedani, M., Tofail, S.A.M., Dikinson, C. and Tuissi, A. (2012) ‘On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS’, Fracture and Structural Integrity, 7(23), pp. Pages 7–12. doi: 10.3221/IGF-ESIS.23.01.

Vancouver

Casati R, Vedani M, Tofail SAM, Dikinson C, Tuissi A. On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS. Fracture and Structural Integrity. 2012;7(23):Pages 7-12. doi:10.3221/IGF-ESIS.23.01

BibTeX

@article{casati2012, author = {Casati, Riccardo and Vedani, Maurizio and Tofail, Syed A. M. and Dikinson, Calum and Tuissi, Ausonio}, title = {On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS}, journal = {Fracture and Structural Integrity}, year = {2012}, volume = {7}, number = {23}, pages = {Pages 7--12}, doi = {10.3221/IGF-ESIS.23.01}, url = {https://doi.org/10.3221/IGF-ESIS.23.01}, issn = {1971-8993} }

RIS

TY - JOUR AU - Casati, Riccardo AU - Vedani, Maurizio AU - Tofail, Syed A. M. AU - Dikinson, Calum AU - Tuissi, Ausonio TI - On the preparation and characterization of thin NiTi shape memory alloy wires for MEMS JO - Fracture and Structural Integrity T2 - Fracture and Structural Integrity PY - 2012 DA - 2012/12/28 VL - 7 IS - 23 SP - Pages 7 EP - 12 DO - 10.3221/IGF-ESIS.23.01 UR - https://doi.org/10.3221/IGF-ESIS.23.01 SN - 1971-8993 ER -

Licence

Copyright © 2014 Fracture and Structural Integrity.

Copyright 
Authors are allowed to retain both the copyright and the publishing rights of their articles without restrictions.  

Open Access Statement

Fracture and Structural Integrity (F&SI) is an open-access journal which means that all content is freely available without charge to the user or his/her institution. Users are allowed to read, download, copy, distribute, print, search, or link to the full texts of the articles in this journal without asking prior permission from the publisher or the author. This is in accordance with the DOAI definition of open access.

F&SI operates under the Creative Commons Licence Attribution 4.0 International (CC-BY 4.0). This allows to copy and redistribute the material in any medium or format, to remix, transform and build upon the material for any purpose, even commercially, but giving appropriate credit, providing a link to the license, and indicating if changes were made.

Similar articles

Most read articles by the same author(s)