In this research, the effect of thermally expandable microcapsules (TEMs) on mode I fracture toughness of structural adhesives were investigated. The single-edge-notch bending (SENB) test was used. Firstly, a standard toughness test was performed on adhesives with microcapsules. Secondly, since TEMs start their expansion at approximately 60ºC, the next specimens were fatigue tested expecting a local heating in the notch leading to the desired expansion before being statically loaded for fracture toughness determination. Thirdly, a manual local heating at 90ºC was applied in the notch before the fracture static test. The experimental results were successfully cross-checked through a numerical analysis using the virtual crack closure technique (VCCT) based on linear elastic fracture mechanics (LEFM). The major conclusion is that fracture toughness of the modified adhesives increased as the mass fraction of the TEMs increased.
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How to cite
APA
Pesquet, G., da Silva, L. F. M., & Sato, C. (2011). The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives. Fracture and Structural Integrity, 5(16), pages 18–27. https://doi.org/10.3221/IGF-ESIS.16.02
IEEE
G. Pesquet, L. F. M. da Silva, and C. Sato, “The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives,” Fracture and Structural Integrity, vol. 5, no. 16, pp. pages 18–27, 2011, doi: 10.3221/IGF-ESIS.16.02.
MLA
Pesquet, Guillaume, et al. “The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives.” Fracture and Structural Integrity, vol. 5, no. 16, 2011, pp. pages 18–27. https://doi.org/10.3221/IGF-ESIS.16.02.
Chicago
Pesquet, Guillaume, Lucas F. M. da Silva, and Chiaki Sato. 2011. “The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives.” Fracture and Structural Integrity 5 (16): pages 18–27. https://doi.org/10.3221/IGF-ESIS.16.02.
Harvard
Pesquet, G., da Silva, L.F.M. and Sato, C. (2011) ‘The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives’, Fracture and Structural Integrity, 5(16), pp. pages 18–27. doi: 10.3221/IGF-ESIS.16.02.
Vancouver
Pesquet G, da Silva LFM, Sato C. The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives. Fracture and Structural Integrity. 2011;5(16):pages 18-27. doi:10.3221/IGF-ESIS.16.02
BibTeX
@article{pesquet2011,
author = {Pesquet, Guillaume and da Silva, Lucas F. M. and Sato, Chiaki},
title = {The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives},
journal = {Fracture and Structural Integrity},
year = {2011},
volume = {5},
number = {16},
pages = {pages 18--27},
doi = {10.3221/IGF-ESIS.16.02},
url = {https://doi.org/10.3221/IGF-ESIS.16.02},
issn = {1971-8993}
}
RIS
TY - JOUR
AU - Pesquet, Guillaume
AU - da Silva, Lucas F. M.
AU - Sato, Chiaki
TI - The use of thermally expandable microcapsules for increasing the toughness and heal structural adhesives
JO - Fracture and Structural Integrity
T2 - Fracture and Structural Integrity
PY - 2011
VL - 5
IS - 16
SP - pages 18
EP - 27
DO - 10.3221/IGF-ESIS.16.02
UR - https://doi.org/10.3221/IGF-ESIS.16.02
SN - 1971-8993
ER -
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